【Japanese Only / No English Subtitles】Openair-Plasma^® for Electronics, Semiconductor Packaging, and PCB Manufacturing

Important Notice
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

The manufacturing of electronics, semiconductor packages, and printed circuit boards is constantly facing new challenges.

One important solution is atmospheric-pressure plasma technology, a key manufacturing process that can improve finished-product quality through surface pretreatment and contribute to higher production yield. Have you considered the role this technology can play in improving both quality and process stability?

Our atmospheric-pressure plasma technology, Openair-Plasma^®, enables treatment without electrical potential damage and serves as an important factor in cost efficiency and production stability in the manufacturing of electronic and semiconductor products. By using Openair-Plasma^®, manufacturers can improve component reliability and significantly reduce safety risks in finished products.

In this webinar, we will provide a clear introduction to Openair-Plasma^® technology. We will also explain the added value it can bring to production processes. Through actual application examples, we will demonstrate the wide range of uses for Openair-Plasma^® and explain how it can be applied across various market segments in the manufacturing of electronic and semiconductor products.

In addition, we will introduce an atmospheric-pressure plasma reduction system for semiconductor products, an area that has seen especially strong demand in recent years. By using the powerful reduction capability of Openair-Plasma^®, it is possible to reduce soldering defects and improve wire bonding strength in a completely dry process.

Webinar Topics

• What is Openair-Plasma^® technology?
• Why Openair-Plasma^® can be safely used for electrically sensitive semiconductor products
• Introduction to the various market segments in which it is used
• Application examples across different segments
• Introduction to an atmospheric-pressure plasma reduction system for semiconductor equipment

This webinar is scheduled to run for approximately 50 minutes, including the Q&A session. If you have any questions or would like to discuss the webinar in advance, please contact us here.

Important Information for Participants

Language
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

About Registration
This webinar is free of charge, but advance registration is required.
As all registrations are reviewed and approved manually, it may take several days for approval to be completed. Please note that registrations submitted shortly before or after the start of the webinar may not be accepted. We kindly ask that you register well in advance.
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Request Regarding Registration Method
For this webinar, we ask each participant to complete their own registration individually. Please refrain from having multiple people attend using a single registration. To ensure that future information and materials can be delivered accurately, we kindly ask that each participant register separately.