【Japanese Only / No English Subtitles】Atmospheric-Pressure Plasma Technology: Surface Cleaning with Openair-Plasma^®

Important Notice
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.
 

Cleaning is becoming increasingly important in manufacturing.

In particular, in fields where precise and complex products are manufactured, keeping the surfaces of parts and components clean is key to ensuring the functionality and reliability of the final product. At the same time, conventional wet cleaning using widely used chemicals also involves a range of disadvantages.

Openair-Plasma^® is a cleaning process based on nano-level chemical reactions, making it possible to selectively remove contamination from material surfaces. It is also a completely dry process, making inline integration and retrofitting into production lines easy. In addition, it is effective for products that are sensitive to residual chemicals and offers an environmentally responsible alternative.

Furthermore, thanks to its proprietary potential-free technology, Openair-Plasma^® enables ultra-fine cleaning without affecting electronic and semiconductor components. It can prepare surfaces under optimal conditions for subsequent processes such as coating and bonding, thereby contributing to lower defect rates.

In this webinar, we will introduce the features of cleaning with Openair-Plasma^®, methods for evaluating its cleaning performance, and the differences in cleaning effects depending on the process gas used, together with application examples. We will also present evaluation technologies that make it possible to visualize the cleaning effect achieved with Openair-Plasma^®. We hope you will join us.
 

Webinar Topics

• Effects, principles, and current applications of atmospheric-pressure plasma Openair-Plasma^® technology
• Methods for evaluating plasma cleaning
• Introduction to application examples