【Japanese Only / No English Subtitles】New Surface Treatment Technologies for Semiconductor and Electronics Manufacturing — From Intermediate Processes to Packaging and Assembly, Featuring HydroPlasma^®

Important Notice
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

In the semiconductor, electronics, and many other manufacturing industries, quality requirements such as miniaturization, higher efficiency, greater reliability, and cost reduction are becoming more demanding every year. In semiconductor manufacturing in particular, even microscopic residues and oxide layers can significantly affect yield and reliability, making advanced surface treatment technologies indispensable.

Backed by 30 years of proven experience, our atmospheric-pressure plasma technology, Openair-Plasma^®, has been adopted in a wide range of processes, from intermediate manufacturing steps to packaging and assembly, and has become an important technology supporting semiconductor production. As a safe and environmentally responsible technology that does not rely on chemicals, it delivers a variety of effects including cleaning, adhesion improvement, and reduction, and is used worldwide as an innovative alternative to conventional processes.
 

Key Features of Plasmatreat’s Atmospheric-Pressure Plasma Treatment

• High safety: reduced use of chemicals and an ozone-free, VOC-free process
• Efficient processing: simultaneous contamination removal and surface modification in a single step
• Process improvement: enables automation of surface treatment
• High flexibility: damage-free treatment of metals, plastics, electronic components, and even large parts
• Extensive experience and expertise: backed by more than 30 years of history as a leading company in atmospheric-pressure plasma technology
   

In this webinar, in addition to explaining the principles and application examples of Openair-Plasma^®, we will introduce the newly developed cleaning technology HydroPlasma^®. HydroPlasma^® is an innovative technology that efficiently removes cured and firmly adhered flux residues using only water, without the use of chemicals. It can also process materials at low temperature and low electrical potential, helping prevent damage to the substrate.

In addition, we will cover the REDOX^® tool, which enables dry-process reduction and flux-free bonding, as well as PlasmaPlus^®, which makes functional coatings possible. Through actual application examples, we will explain the possibilities and benefits of these advanced surface treatment technologies that go beyond conventional “plasma treatment.”

Important Information for Participants

Language
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

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