【Japanese Only / No English Subtitles】Innovations in Atmospheric Plasma Driving Next-Generation Semiconductor Packaging — Inline Backend Processing with Particle-Reduced Design and Advanced Reduction Technology

Important Notice
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

As the limits of performance gains through miniaturization continue to rise, increasing attention is being placed on hybrid bonding and wafer bonding technologies that enable higher speed, greater density, and lower power consumption. At the same time, as interconnect structures become finer, even microscopic particles generated during processing can lead to critical defects.

In this webinar, we will first provide a clear overview of the mechanisms by which atmospheric plasma enables surface cleaning and surface activation. We will then introduce the features of our latest plasma nozzles, PFA10 and PDW100, which are designed to suppress particle generation.

In addition, one of the greatest barriers to mass production is the time loss associated with conventional batch processing using vacuum equipment or formic acid. The continuous reduction process REDOX^®, introduced in this webinar, removes oxide layers from metal surfaces under atmospheric pressure without the need for special chemicals or vacuum systems. This makes it possible to achieve both exceptionally high productivity and reliable bonding in processes such as TCB (Thermal Compression Bonding).

Efficient inline surface hydrophilization at wafer level can also be achieved using the latest nozzles introduced in this webinar. In addition, inline plasma coating that enhances adhesion between mold resin and chips and helps meet strict MSL (Moisture Sensitivity Level) requirements has already been proven in a wide range of applications, from individual devices to power module assembly.

Webinar Topics：

• Fundamentals of atmospheric plasma and the features of Openair-Plasma^®: mechanisms for cleaning, activation, and improved adhesion
• Latest nozzles for semiconductor manufacturing in high-cleanliness environments: PFA10 / PDW100
• Ensuring reliability across process boundaries: applications and effects of Openair-Plasma^® / PlasmaPlus^®
• Reduction technology enabling flux-free bonding: REDOX^®

• Additional benefits enabled by plasma applications: plasma coating and HydroPlasma^®

   

Important Information for Participants

Language
This webinar will be conducted in Japanese only. English subtitles and interpretation will not be available.

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