Low-Pressure Plasma and Openair-Plasma^® for Modern Power Electronics

Power modules are key components of modern power electronics in applications such as electric mobility, renewable energy, charging infrastructure, and industrial drives. These include both traditional silicon-based power modules and modern SiC and GaN modules. The performance and long-term reliability of these assemblies depend significantly on clean, activated, and reproducibly prepared surfaces. Even the slightest contaminants, oxide layers, or wetting issues can compromise downstream processes such as die attach, wire bonding, sintering, potting, or encapsulation.

In this PlasmaTalk, you will learn how AURORA plasma (low-pressure plasma) and Openair-Plasma^® are specifically used for the surface treatment of power modules to stabilize manufacturing processes, improve adhesion properties, and sustainably increase the reliability of electronic assemblies. Using real-world applications, Andrej Kolbasow demonstrates how various plasma processes can be applied throughout the entire value chain:

• AURORA Plasma for full-surface precision cleaning and surface activation of complex components in a vacuum
• Openair-Plasma^®  for selective in-line cleaning and activation at atmospheric pressure
• REDOX^®  for the targeted reduction of oxide layers on copper surfaces, lead frames, and DCB and AMB substrates
• HydroPlasma^®  for the removal of challenging organic residues and the optimization of critical surfaces

Applications will be presented for copper surfaces, lead frames, DCB and AMB substrates, Cu pillars, and power modules based on silicon, SiC, and GaN. The focus will be on critical process steps such as sintering, bonding, potting, and encapsulation, as well as the targeted optimization of surfaces prior to subsequent manufacturing processes.

What This PlasmaTalk Covers

• What surface requirements modern power modules must meet
• What special considerations apply to silicon-based power modules as well as SiC and GaN modules
• How cleaning, activation, and oxide removal can improve process reliability
• How wettability and adhesion can be optimized prior to die attach, wire bonding, sintering, and potting
• What potential exists for reducing outgassing
• How plasma supports the long-term reliability of electronic assemblies
• When low-pressure plasma and when atmospheric plasma is the appropriate solution
• How modern plasma technologies can be integrated into existing manufacturing environments

In addition, you’ll learn how modern plasma processes can help reduce outgassing, expand process windows, and achieve reproducible manufacturing results in semiconductor and power electronics production. A special focus will be placed on comparing low-pressure plasma and atmospheric plasma, as well as their integration into existing production environments.

Discover the latest trends in the manufacturing of power modules and SiC modules, and learn how plasma technologies can sustainably support process reliability, quality, and the reliability of modern power electronics.

This free PlasmaTalk is aimed at employees in the fields of research, development, and quality assurance, as well as designers, process engineers, and plant operators in battery manufacturing.

The webinar offers practical insights and a live Q&A session in 40 to 60 minutes. Do you have specific questions? Send them in advance to academy@plasmatreat.com — we’ll answer them live during the webinar.