Openair-Plasma® solutions for semiconductor applications

In semiconductor manufacturing, every detail counts. From bonding to encapsulation, processes must be precise, reliable, and efficient. Openair-Plasma^® delivers exactly that: particle-free, inline surface treatment solutions that boost quality and ensure process stability at industrial scale.

Our expert Nico Coenen, Global Director Electronics Market, will demonstrate in this PlasmaTalk, how plasma microfine cleaning and activation can replace costly vacuum processes with fast, reproducible, inline solutions.

Key topics include:

• Wire bonding, die bonding, underfill, molding & encapsulation
• Redox plasma for flux-free thermal compression bonding (TCB)
• The latest particle-free jet technology for sensitive electronics 

Why join?

• Cut costs & save time with inline plasma treatment instead of vacuum processes
• Boost performance through improved adhesion, stability, and throughput
• Stay ahead with innovative, particle-free and flux-free solutions for advanced electronics 

This complimentary PlasmaTalk is intended for research, development, and quality control professionals, as well as designers, process engineers, and operators of production equipment in industrial processes.

This webinar provides practical insights, fresh perspectives, and a live Q&A session to address your specific questions. The PlasmaTalk will run for approximately 40–60 minutes.

Please note that due to our international audience, we will be using UTC (Coordinated Universal Time). Please check your time zone using the TimeCalc calculator below.

Have specific questions? Send them in advance to academy@plasmatreat.com, and we will address them live during the webinar.